崗位職責(zé):
1.To manage integration of all modules’ processes and the respective derivatives;
2.To provide a leading role in the developing, transferring and maintaining of advanced DRAM fabrication technology with good process capability and high yield.Lead new technology transfer from mother fab or process development;
3.Owner of new prototype lots and ensure 100% success rate;
4.Drive process robustness improvement by providing root cause analysis and and collaborate improvement actions to meet 100% wafer acceptance test (WAT) Cpk goal & Baseline D0 target.
任職要求:
1.半導(dǎo)體或物理與材料科學(xué)專業(yè)碩士背景,8年以上工作經(jīng)驗(yàn),其中2年管理經(jīng)驗(yàn);
2.PIE、DEFECT、METRO、DEVICE、YE、精通任一Module PE相關(guān)方向經(jīng)驗(yàn)均可,具有DRAM和TD經(jīng)驗(yàn)者優(yōu)先;
3.具備良好的領(lǐng)導(dǎo)能力和與跨部門的溝通技巧;
4.技術(shù)問題決策,并具備出色的領(lǐng)導(dǎo)團(tuán)隊(duì)快速解決問題的能力;
5.熟悉Fab/TD流程,具備良好的項(xiàng)目管理技能;
6.熟悉技術(shù)轉(zhuǎn)移,了解研發(fā)轉(zhuǎn)量產(chǎn)全流程。