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崗位職責(zé)：
?? Coordinate and consolidate the response process to customer’s technical queries.
? Follow up and manage critical product build such as new technical development, critical NPI project and qualification product build.
? Technical support for Sales team to win business
? Report and presenting technical updates and customer technology trend
? DFM trouble shooting
? Offer flexible/alternative technology solutions to help customer achieve target
? Travel to support customer development, escort customer visits.
1. 協(xié)調(diào)和優(yōu)化客戶響應(yīng)流程，及時幫助客戶解決技術(shù)問題。
2.跟進和管理關(guān)鍵產(chǎn)品開發(fā)，如新技術(shù)開發(fā)、關(guān)鍵新產(chǎn)品導(dǎo)入（NPI）項目和進行產(chǎn)品質(zhì)量管控。
3.為銷售團隊提供技術(shù)支持。
4.報告和展示技術(shù)更新情況及市場趨勢。
5.解決DFM溝通過程中遇到的問題。
6.根據(jù)客戶需求，提供靈活/替代的技術(shù)解決方案，幫助客戶實現(xiàn)目標。
7.需要陪同來訪客戶，出差拜訪客戶，向客戶推介公司的新產(chǎn)品新技術(shù)，促進業(yè)務(wù)增長。
任職要求：
? 8+ years product engineering, process engineering or quality engineering experiences in EMS industry
? Knowledge & skills of project management
? Excellent English language skills, both verbal and written
? Familiar with high-end HDI PCB and substrate products.
? Initiative and responsible.
? Travel is required by this job.
1.擁有8年以上電子制造行業(yè)的產(chǎn)品工程、工藝工程或質(zhì)量工程經(jīng)驗。
2.具有項目管理的知識和技能。
3. 優(yōu)秀的英語語言能力，包括口頭和書面表達。
4.熟悉高端HDI PCB或基板，有FCBGA產(chǎn)品經(jīng)驗者優(yōu)先。
5.主動并有責(zé)任心，能適應(yīng)出差。