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公司簡(jiǎn)介微石新材成立于2020年,主要研發(fā)、生產(chǎn)和銷售中高端導(dǎo)熱粉體材料,在安徽蕪湖和四川達(dá)州均設(shè)有研發(fā)中心、生產(chǎn)基地,在上海、廣東東莞設(shè)有銷售和技術(shù)服務(wù)中心。公司專注于以球形化為主的導(dǎo)熱粉體深加工領(lǐng)域,掌握各類導(dǎo)熱粉體的形貌控制、粒徑控制、晶相轉(zhuǎn)化、粉體提純、表面處理等核心技術(shù),在粉體球化、燒結(jié)、卡斷、分散、改性等方面均有深入研究。公司主要產(chǎn)品有球形氧化鋁、高性能單晶氧化鋁、球形氮化鋁、球形氮化硼等各類中高端導(dǎo)熱粉體。公司產(chǎn)品廣泛應(yīng)用于導(dǎo)熱界面材料、半導(dǎo)體封裝、先進(jìn)功能陶瓷等領(lǐng)域,終端應(yīng)用于汽車電子、人工智能、通信電子、消費(fèi)電子等行業(yè)。Founded in June 2020, Microstone specializes in the research, development, production,and sales ofthermal conductive powder materials, We have an advanced R&D center andmanufacturing facility in Dazhou, Sichuan, supported by customer service centers in Shanghaiand Dongguan, Guangdong. At Microstone, we have honed our expertise in core technologies such as powdermorphology control, particle size optimization, crystal phase transition, powder purification, andsurface treatment for thermal conductive powders, Our flagship products include a range ofmid-to-high-end thermal conductivity powders, such as spherical alumina, roundish alumina.aluminum nitride, and boron nitride. Our product offerings find extensive application in thermal interface materials,high-thermal-conductivity copper clad laminates(CCL), and epoxy molding compound(EMC)packaging materials, These materials are widely used in components for automotive electronics,Al hardware,telecommunications, consumer electronics,and so on.